One chassis.
Every configuration.

L · Single-layer slim design with swappable CPU module. 128×128×52 mm, ~0.7 kg.

X · Triple-layer stacking with GPU, CPU and dual I/O expansion. 128×128×97 mm, ~1.7 kg.

Z · Dual-layer stacking with one I/O expansion slot. 128×128×73 mm, ~0.9 kg.

Z · Swappable Intel 11th Gen Core compute module with on-board LPDDR4.

Z · Swappable Intel 8th Gen Core compute module with on-board memory.

Z · Swappable Intel 12th Gen Core compute module with hybrid P/E cores and LPDDR5.

Z · Dual 2.5GbE plus dual serial ports, convertible to CAN.

Z · Cellular 4G / 5G connectivity expansion for remote deployments.

Z · Six Mini DisplayPort outputs for multi-screen signage.

Z · Legacy display and serial expansion with extra storage and 2.5GbE.

Z · Six RJ45 GbE ports on one expansion layer.

X · Desktop-class discrete graphics in a swappable expansion layer.

DevKit · Compact dev board accepting all 8th/11th/12th Gen swappable CPU modules.

DevKit · Compact dev board with soldered 10th Gen Intel Core and DDR4 SODIMM slot.

DevKit · Dev board with soldered 12th Gen P-series Core and edge-finger expansion.

DevKit · Dev board with edge-finger expansion, accepting all 8th/11th/12th Gen CPU modules.